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SL6610
Direct Conversion FSK Data Receiver Advance Information
Supersedes the October 1994 edition, DS4003 - 1.4 DS4003 - 2.2 September 1995
This device is an advanced direct conversion receiver for operation up to 470MHz. The design is based on the SL6609A but is specifically designed for use in very small pagers i.e. credit card sized, where local oscillator re-radiation is a problem. This design has overcome this difficulty. The device also includes a 1 volt regulator capable of sourcing up to 5mA, a battery flag and the facility of incorporating a more complex post detection filter off-chip. Both battery flag and data outputs have open collector outputs to ease their interface with other devices. Adjacent channel rejection is provided using tuneable gyrator filters. To assist operation in the presence of large interfering signals both RF and audio AGC functions are provided.
TPX MIXER DECOUPLE LOY GYRI LOX VR TPY GTHADJ TCADJ BEC BATTFL TPLIMY VCC2 DATAOP
1 2 3 4 5 6 7 8 9 10 11 12 13 14
28 27 26 25 24 23 22 21 20 19 18 17 16 15
IAGCOUT IRFAMP MIXA GND MIXB VREG REGCNT VCC1 VBATT VBG DIGGND BRF1 BRF2 TPLIMX
NP28
FEATURES
s s s s s Very low power operation - typ 3.0mW Superior sensitivity of -130dBm Operation at wide range of paging data rates 512, 1200, 2400 baud Small package offering SSOP Excellent performance of LO Rejection
Fig.1 Pin connections
ABSOLUTE MAXIMUM RATINGS
Supply voltage Storage temperature Operating temperature 6V -55C to +150C -20C to +70C
APPLICATIONS
s s s Credit card pagers Watch pagers Small form factor pagers i.e. PCMCIA
ORDERING INFORMATION
SL6610 / KG / NPDS SL6610 / KG / NPDE - SSOP devices in anti-static sticks - SSOP devices in tape and reel
Fig.2 Block diagram of SL6610
SL6610
ELECTRICAL CHARACTERISTICS These characteristics are guaranteed over the following conditions unless otherwise stated: Tamb = 25C, VCC1 = 1.3V, VCC2 = 2.7V Value Characteristics Pin Min VCC1 - Supply voltage VCC2 - Supply voltage ICC1 - Supply current 21 13 21,27,28 0.95 1.8 Typ 1.3 2.7 1.5 Max 2.8 3.5 1.8 V V mA Includes IRF. Does not include regulator supply. Audio AGC inactive Batt flag & Data O/P high Pin 27 voltage: 0.3 - 1.3V VCC1 < VCC2 - 0.7 volts Units Comments
ICC2 - Supply current Power down ICC1 Power down ICC2 1 volt regulator
11,13,14 21,27,28 11,13,14 23 0.95
550
700 1 8
A A A V
1.0
1.05
I Load = 3mA. Ext PNP. >= 100, VCE = 0.1 volt
Band gap voltage reference Band gap current source Voltage reference Voltage reference sink/source 1 volt regulator load current Turn on Time
19 19 6 6
1.15 0.93 0.25
1.21 1.0 3 5
1.27 20 1.07 10 5
V A V A mA ms
VCC1 > 1.1V
Stable data o/p when 3dB above sensitivity. CBG and CVR = 2.2F Fall to 10% of steady state current CBG and CVR = 2.2F
Turn off Time
1
ms
Detector output current RF current source Current Source (IRF)
17
+/-4
A
27
400
500
600
A
Pin 27 voltage: 0.3 - 1.3V
Decoder Sensitivity 40 Vrms Signal injected at TPX and TPY B.E.R. < 1 in 30 5KHz deviation @ 1200 bits/sec BRF capacitor = 1nF Output logic low Output Iogic high
Output mark space ratio Data O/P Sink Current Data O/P Leakage Current
14 14 14
7:9 100
9:7 500 1.0
A A
2
SL6610
ELECTRICAL CHARACTERISTICS These characteristics are guaranteed over the following conditions unless otherwise stated: Tamb = 25C, VCC1 = 1.3V, VCC2 = 2.7V Value Characteristics Pin Min Battery Economy Input logic high Input logic low Input current Input current Battery Flag Input Input current Battery Flag Output Battfl Sink Current Battfl leakage current Mixers Gain to "IF Test" RF input impedance LO input impedance LO DC bias voltage Audio AGC Max Audio AGC Sink Current 24, 26 3, 5 3, 5 Typ Max Units Comments
10 10 10 10
(VCC2 - 0.3) 0.05 6 0.3 1 8
V V A A
Powered Up Powered Down Powered Up Powered down transient initial
20
1
A
11 11
50
500 1
A A
(VBATT-VR) > 20mV (VBATT-VR) < -20mV
34
41
dB
V
LO inputs driven in parallel with 50mVRMS @ 50MHz.IF = 2kHz See Figs.8a, 8b See Fig.9 Equal to Pin 21 (VCC1)
28
45
65
85
A
RECEIVER CHARACTERISTICS (Demonstration board)
Measurement conditions unless stated VCC1 = 1.3V, VCC2 = 2.7V, LNA = 18dB Power Gain, 2dB Noise figure, Carrier frequency 153MHz, BER 1 in 30, Tamb = 25C (TPx/TPy typically:- 160mVPP 10% for - 73dBm RF input to the LNA) Value Characteristics Pin Min Sensitivity -130 Typ -128 Max -125 dBm 1200 bps f = 4kHz LO = -18dBm 1200 bps f = 4kHz LO = -18dBm 1200 bps f = 4kHz LO = -18dBm Channel spacing 25kHz 1200 bps f = 4kHz LO = -18dBm 1200 bps f = 4kHz LO = -18dBm Units Comments
Intermodulation
52
56
dB
Adjacent channel
68
73
dB
Centre frequency acceptance
+/-2.3
kHz
Deviation acceptance
+/-2.2
kHz
3
SL6610
RECEIVER CHARACTERISTICS (Demonstration board)
Measurement conditions unless stated VCC1 = 1.3V, VCC2 = 2.7V, LNA = 20dB Power Gain, 2dB Noise figure, Carrier frequency 282MHz, BER 1 in 30, Tamb = 25C (TPx/TPy typically:- 160mVPP 10% for - 73dBm RF input to the LNA) Value Characteristics Pin Min Sensitivity -130 Typ -128 -125.5 Max -125 -122 dBm dBm 1200 bps f = 4kHz 2400 bps f = 4.5kHz LO = -15dBm 1200 bps f = 4kHz 2400 bps f = 4.5kHz LO = -15dBm 1200 bps f = 4kHz LO = -15dBm 1200 bps f = 4kHz 2400 bps f = 4.5kHz LO = -15dBm Channel spacing 25kHz 1200 bps f = 4kHz 2400 bps f = 4.5kHz LO = -15dBm 1200 bps f = 4kHz 2400 bps f = 4.5kHz LO = -15dBm Units Comments
Intermodulation (IP3)
52 49
56 53.5
dB
Intermodulation (IP2)
47
52
dB
Adjacent channel
67 64
72.5 69.5
dB
Centre frequency acceptance
+/-1.9
+/-2.3 +/-2
kHz
Deviation acceptance
+/-2.2 +/-2
kHz
RECEIVER CHARACTERISTICS
Measurement conditions unless stated VCC1 = 1.3V, VCC2 = 2.7V, LNA = 22dB Power Gain, 2dB Noise figure, Carrier frequency 470MHz, BER 1 in 30, Tamb = 25C (TPx/TPy typically:- 140mVPP 10% for - 73dBm RF input to the LNA) Value Characteristics Pin Min Sensitivity -128 Typ -126 Max -123 dBm 1200 bps f = 4kHz LO = -15dBm 1200 bps f = 4kHz LO = -15dBm 1200 bps f = 4kHz LO = -15dBm Channel spacing 25kHz 1200 bps f = 4kHz LO = -15dBm 1200 bps f = 4kHz LO = -15dBm Units Comments
Intermodulation
50
55.5
dB
Adjacent channel
67
72.5
dB
Centre frequency acceptance
+/- 2.3
kHz
Deviation acceptance
+/- 2.2
kHz
4
SL6610
RECEIVER CHARACTERISTICS (Demonstration board)
Measurement conditions unless stated LNA = 18dB Power Gain, 2dB Noise figure, Carrier frequency 282MHz, BER 1 in 30, Tamb = 0 to 45C, Vcc2 = 2.7V, Vcc1 = 1.2V to 1.6V (TPx/TPy typically:- 120mVPP 10% for - 73dBm RF input to the LNA) Value Characteristics Pin Min Sensitivity (Desense from 25C, VCC1 = 1.3V) Intermodulation (IP3) 53 47 58 Typ Max 1.5 dB dB 1200 bps f = 4kHz LO = -15dBm 1200 bps f = 4kHz LO = -15dBm 1200 bps f = 4kHz LO = -15dBm 1200 bps f = 4kHz LO = -15dBm Channel spacing 25kHz 1200 bps f = 4kHz LO = -15dBm 1200 bps f = 4kHz LO = -15dBm Units Comments
Intermodulation (IP2)
53
dB
Adjacent channel
66
72.5
dB kHz
Centre frequency acceptance
+/-1.8
+/-2.3 +/-2.2
kHz kHz
Deviation acceptance
LO Rejection:0.5dB Sensitivity loss 3dB Sensitivity loss
-59 -52
-55 -48
-44
dBm dBm
Level of local oscillator at the RF input to the LNA
5
SL6610
OPERATION OF SL6610
The SL6610 is a Direct Converson Receiver designed for use up to 470MHz. It is available in a 28 pin SSOP package and it integrates all the facilities required for the conversion of an RF FSK signal to a base-band data signal. Low Noise Amplifier To achieve optimum performance it is necessary to incorporate a Low Noise RF Amplifier at the front end of the receiver. This is easily biased using the on chip voltage and current sources provided. All voltages and current sources used for bias of the RF amplifier, receiver and mixers should be RF decoupled using suitable capacitors (see fig.4 for a suitable Low-NoiseAmplifier). Local Oscillator The Local Oscillator signal is applied to the device in phase quadrature. This can be achieved with the use of two RC networks operating at the -3dB/45 transfer characteristic, giving a full 90 phase differential between the LO ports of the device. Each LO port of the device also requires an equal level of drive from the Oscillator. (see Fig.5). Gyrator Filters The on chip filters include an adjustable gyrator filter. This may be adjusted with the use of an additional resistor between pin 4 and GND. This allows flexibility of filter characterstics and also allows for compensation for possible process variations. Audio AGC The Audio AGC fundamentally consists of a current sink which is controlled by the audio (baseband data) signal. It has three parameters that may be controlled by the user. These are the Attack (turn on) time, Decay (duration) time and Threshold level (see Fig.6 and 7). See Application note for details. Regulator The on chip regulator must be used in conjunction with a suitable PNP transistor to achieve regulation. As the transistor forms part of the regulator feedback loop the transistor should exhibit the following characteristics:HFE > = 100 for VCE > = 0.1V
Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
Pin Name TPX MIX-DEC LOY GYRI LOX VR TPY GTHADJ TCADJ BEC BATTFL TPLIMY VCC2 DATAOP TPLIMX BRF2 BRF1 DIG GND VBG VBATT VCC1 REGCNT VREG MIXB GND MIXA IRFAMP IAGCOUT
Pin Description X channel pre-gyrator filter test-point. This can be used for input and output Mixer bias de-couple pin LO input channel Y Gyrator current adjust pin LO input channel X VREF 1.0 V internal signal ground Y channel pre-gyrator filter test point, input or output Audio AGC gain and threshold adjust. RSSI signal indicator Audio AGC time constant adjust Battery economy control Battery flag output Y channel limiter (post gyrator filter) test point, output only Supply connection Data output pin X channel limiter (post gyrator filter) test point, output only Bit rate filter 2, input to data output stage Bit rate filter 1, output from detector Digital ground Bandgap voltage output Battery flag input voltage Supply connection 1V regulator control external PNP drive 1V regulator output voltage Mixer input B Ground Mixer input A Current source for external LNA. Value of current output will decrease at high mixer input signal levels due to RF AGC Audio AGC output current
6
SL6610
Fig.3 Application circuit board
7
SL6610
COMPONENTS LIST FOR APPLICATION BOARD At 282MHz, 25kHz Channel Spacing.
(LO Circuit in Fig.3) Resistors R1 open circuit R2 not used R3 100 R4 100k R5 1k R6 1k R7 100 R8 open circuit R9 220k R10 1M R11 100k (6) R12 not used R13 1k5(1) R14 4k7 R15 4k7 R16 33k R17 not used R18 0R (3) R19 10k R20 620 R21 1k R22 open circuit Capacitors C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C17a Notes 1. The values of R13 is determined by the set-up procedure. See Application Note. The value of C9 is determined by the output data rate. Use 2nF for 512bps, 1nF for 1200bps and 470pF for 2400bps. L2 is used in the Audio AGC circuit (see Fig. 6). For the characteristics of the Audio AGC current source see Fig.7. If the audio AGC is not required then the current source (Pin 28) may be disabled by connecting Pin 9 (TCADJ) to VR (Pin 6) and by connecting Pin 28 (IAGCOUT) to Vcc1, (R18). The voltage at Pin 8 may still be used as an RSSI. R9, C8, C14, C19, R17 and D1 may then be omitted. See Fig.6 for AGC component values. 4. L1and C26 form the low noise matching network for the RF amplifier. The values given are for the RF amplifier specified in the Applications Circuit with no Audio AGC connected. i.e. R17 and D1 omitted. Suggested diode for use with the Audio AGC circuit (see Fig.6) (D1 is not included on the general demonstration circuit). The value of R11 is dependent on the data output load. R11 should allow sufficient current to drive the data output load. C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 C29 C30 C31 C32 C33 C34 C35 VC1 VC2 VC3 Inductors L1 L2 L3 L4 L5 1n 100n 1n 1n not used 1n 1n 1n 6p8 1n 1n 100p 2u2 2u2 4p7 4p7 3p3 not used 1-10p 1-10p 1-10p
1n 2p7 4p7 1n 2p7 2u2 1n 100n 1n (2) 2u2 100n 1n 1n 1n 1n 1n 1n 1n
68n (4) not used (3) 470n 39n 680n
Active Components Q1 FMMT589 Q2 2SC5065 (Toshiba) Q3 BFT25A (Philips) Q4 not used Q5 2SC5065 (Toshiba) D1 Panasonic MA862 (5) Misc T1 Xtal
30nH 1:1 Coilcraft M1686-A 5th Overtone 94.075MHz
2.
5.
3.
6.
8
SL6610
COMPONENTS LIST FOR APPLICATION BOARD At 470MHz, 25kHz Channel Spacing.
(LO circuit is 50 network as in Fig.5 - crystal oscillator not specified) Resistors R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 R15 R16 R17 R18 R22 Capacitors C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 Notes 1. The values of R13 is determined by the set-up procedure. See Application Note. The value of "C9" is determined by the output data rate. Use 2nF for 512bps, 1nF for 1200bps and 470pF for 2400bps. R12 & Q4 form a dummy load for the regulator. Permitted load currents for the regulator are 250A to 5mA. The 1V regulator (output Pin 23) can be switched off by connecting Pin 23 directly to VCC2. Q1, Q4, R12 and C12 must then be omitted L2 is used in the Audio AGC circuit (see Fig.6). For the characteristics of the Audio AGC current source see figure 7. If the Audio AGC is not required then the current source (Pin 28) may be disabled by connecting Pin 9 (TCADJ) to VR (Pin 6) and by connecting Pin 28 (IAGCOUT) to Vcc1, (R18). The voltage at Pin 8 may still be used as an RSSI. R9, C8, C14, C19, R17 and D1 may then be omitted. 5. L1and C26 form the low noise matching network for the RF amplifier. The values given are for the RF amplifier specified in the Applications Circuit with no Audio AGC connected. i.e. R17 and D1 omitted. Suggested diode for use with the Audio AGC circuit (D1 is not included on the general demonstration circuit). The value of R11 is dependent on the data output load. R11 should allow sufficient current to drive the data output load. 1n 3.3pF 1n 1n 3.9pF 2u2 1n 100n 1n (2) 2u2 100n 1n 1n open circuit not used 100 100k 100 100 100 open circuit 220k 1M 100k (2) 300 (3) 3k9 (1) 4k7 4k7 33k open circuit (4) 0R (4) open circuit C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 C29 C30 C31 C34 VC1 Inductors L1 L2 T1 47nH (5) not used (3) 16nH 2 Turn 1:1 (Coilcraft) Q4123-A 1n 1n 1n 1n 1n 100n 1n 1n not used not used 1n 1n open circuit not used not used 100p 2u2 2u2 1p5 1-3pF
Active Components Q1 Q2 Q3 Q4 Q5 D1 Zetex FMMT589 Philips BFT25A Not Used Philips BFT25A(3) Philips BFT25A Panasonic MA862(6)
2.
3.
6.
4.
7.
9
SL6610
Fig.4 RF amplifier
RF Amplifier Components Values
Resistors R14, R15 R13 R22 4k7 see note 1 47k
Capacitors C13, C15 C16, C17 C20, C21 C24, C25 L2
1nF 1nF 1nF see note 2 1nF 820nH
Active components D1 MA862 (Panasonic)
Notes: (1) The value of R13 is determined by the set up procedure (See "Set up for optimum performance"). (2) C20 and C21 are purely for deomonstration purposes. Pin 24 and Pin 26 may be DC coupled provided that no DC voltage is applied to the mixer inputs. 280MHz 6.8p not used 68nH 2p2 30nH Coilcraft M1686-A 1-10pF Toshiba 2SC5065 450MHz not used not used 39nH 1p5 16nH Coilcraft Q4123-A 1-3pF Philips BFT25A
Frequency Dependent Components
153MHz not used not used 150nH 3p3 100nH Coilcraft N2261-A VC1 1-10pF Q4, Q5 Toshiba 2SC5065 (See also Lo drive Network) C26 C27 L1 C34 T1
Fig.5 Local oscillator drive network
LO Drive Network Component Values
50Ohm input impedance (External LO injection) 153MHz 280MHz 450MHz C2 10p 5p6 3p3 C5 10p 5p6 3p9 C3, C4, C18 = 1n R3, R5, R6, R7 = 100Ohms
Higher Input Impedance (crystal oscillator input)
153MHz 280MHz 450MHz C3 Set by load allowable on crystal oscillator (typical 4p7) C2 10p 5p6 3p3 C5 10p 5p6 3p9 R3 100 100 100 R7 100 100 100 R5, R6 = 1k C4, C18 = 1n
10
SL6610
Fig.6 AGC Schematic
Fig.7 Audio AGC current vs. IP power at 25C
11
SL6610
S11
FREQ 50.000 100.000 150.000 200.000 250.000 300.000 350.000 400.000 450.000 500.000 550.000 600.000 650.000 700.000 750.000 800.000 850.000 900.000 950.000 1000.00 MAG 0.969 0.958 0.942 0.917 0.893 0.858 0.832 0.806 0.781 0.755 0.743 0.725 0.703 0.680 0.666 0.653 0.636 0.615 0.604 0.600 ANG -7.20 -14.45 -20.59 -26.40 -33.26 -39.84 -44.78 -49.01 -54.00 -59.53 -64-35 -68.43 -73.01 -78.74 -83.76 -87.48 -91.32 -97.17 -102.84 -105.23
1 .5 2
.2
50MHz
1GHz
Fig.8a SL6609A Mixer A input S-Parameters
S11
FREQ 50.000 100.000 150.000 200.000 250.000 300.000 350.000 400.000 450.000 500.000 550.000 600.000 650.000 700.000 750.000 800.000 850.000 900.000 950.000 1000.00
MAG 0.970 0.960 0.945 0.919 0.902 0.872 0.850 0.825 0.803 0.776 0.760 0.739 0.717 0.698 0.683 0.666 0.659 0.647 0.637 0.634
ANG -7.06 -13.83 -19.90 -25.70 -32.18 -38.03 -43.07 -48.27 -53.58 -58.49 -63.08 -67.98 -72.63 -76.96 -81.09 -85.49 -89.51 -93.90 -98.42 -102.40
1 .5 2
.2
50MHz
1GHz
Fig.8b SL6609A Mixer B input S-Parameters
S11
FREQ 50.000 100.000 150.000 200.000 250.000 300.000 350.000 400.000 450.000 500.000 550.000 600.000 650.000 700.000 750.000 800.000 850.000 900.000 950.000 1000.00
MAG 0.993 0.995 0.997 0.997 0.996 0.986 0.965 0.936 0.902 0.872 0.838 0.804 0.798 0.810 0.784 0.779 0.790 0.788 0.768 0.743
ANG -4.17 -8.43 -12.88 -17.57 -22.63 -28.16 -33.87 -39.17 -43.88 -48.54 -52.81 -56.60 -59.47 -65.19 -71.49 -75.97 -82.54 -91.16 -100.20 -108.52
1 .5 2
.2
50MHz
1GHz
Fig.9 SL6609A LO X,Y inputs S-Parameters
12
SL6610
Fig.10a AC parameters vs. supply and temperature
Conditions:- 282MHz demonstration board i.e. 20dB LNA, 2dB noise figure, carrier frequency 282MHz, 1200bps baud rate, 4kHz deviation frequency, BER 1 in 30.
Vcc1 = 1.0V, Vcc2 = 1.8V Vcc1 = 1.3V, Vcc2 = 2.7V Vcc1 = 3.0V, Vcc2 = 4.0V
13
SL6610
Fig.10b AC parameters vs. supply and temperature
Conditions:- 282MHz demonstration board i.e. 20dB LNA, 2dB noise figure, carrier frequency 282MHz, 1200bps baud rate, 4kHz deviation frequency, BER 1 in 30.
Vcc1 = 1.0V, Vcc2 = 1.8V Vcc1 = 1.3V, Vcc2 = 2.7V Vcc1 = 3.0V, Vcc2 = 4.0V
14
SL6610
Fig.11 DC parameters vs. supply and temperature (IP3 vs audio AGC both on and off)
Conditions:- ICC1 includes 500A LNA current but does not include the regulator supply (audio AGC inactive). ICC2 measured with BATT FLAG and DATA O/P HIGH, Fc = 282MHz. Note 1- IP3 is level above wanted needed to reduce receiver to 1 in 30 B.E.R.
Vcc1 = 0.98V, Vcc2 = 1.78V Vcc1 = 1.3V, Vcc2 = 2.7V Vcc1 = 3.0V, Vcc2 = 4.0V
15
SL6610
Fig.12 Sensitivity, IP3 vs Receiver Gain
Fig.13 Sensitivity, adjacent Channel vs Receiver Gain
16
SL6610
282MHz, 1200bps, 4kHz Deviation
-122
Sensitivity (dBm)
-123 -124 -125 -126 -127 -128 -129 Sensitivity IP3
56
54 53 52
-25
-23
-21
-19
-17
-15
-13
-11
-9
-7
LO Drive Level (dBm)
Fig.14 Sensitivity, IP3 vs LO level
-122
-5
73.5
Sensitivity (dBm)
-124 -125 -126 -127 -128 -129
72.5 72 71.5 71
-25
-23
-21
-19
-17
-15
-13
-11
-9
-7
LO Drive Level (dBm)
Fig.15 Sensitivity, Adjacent Channel vs LO level
-5
Adj. Channel (dB)
-123
Sensitivity ACR
73
IP3 (dB)
55
17
SL6610
PACKAGE DETAILS Dimensions are shown thus: mm (in)
HEADQUARTERS OPERATIONS MITEL SEMICONDUCTOR Cheney Manor, Swindon, Wiltshire SN2 2QW, United Kingdom. Tel: (01793) 518000 Fax: (01793) 518411 MITEL SEMICONDUCTOR 1500 Green Hills Road, Scotts Valley, California 95066-4922 United States of America. Tel (408) 438 2900 Fax: (408) 438 5576/6231
Internet: http://www.gpsemi.com CUSTOMER SERVICE CENTRES q FRANCE & BENELUX Les Ulis Cedex Tel: (1) 69 18 90 00 Fax : (1) 64 46 06 07 q GERMANY Munich Tel: (089) 419508-20 Fax : (089) 419508-55 q ITALY Milan Tel: (02) 6607151 Fax: (02) 66040993 q JAPAN Tokyo Tel: (03) 5276-5501 Fax: (03) 5276-5510 q KOREA Seoul Tel: (2) 5668141 Fax: (2) 5697933 q NORTH AMERICA Scotts Valley, USA Tel: (408) 438 2900 Fax: (408) 438 5576/6231 q SOUTH EAST ASIA Singapore Tel:(65) 3827708 Fax: (65) 3828872 q SWEDEN Stockholm Tel: 46 8 702 97 70 Fax: 46 8 640 47 36 q TAIWAN, ROC Taipei Tel: 886 2 25461260 Fax: 886 2 27190260 q UK, EIRE, DENMARK, FINLAND & NORWAY Swindon Tel: (01793) 726666 Fax : (01793) 518582 These are supported by Agents and Distributors in major countries world-wide. (c) Mitel Corporation 1998 Publication No. DS4003 Issue No. 2.2 September 1995 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
18
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Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively "Zarlink") is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink. This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink's conditions of sale which are available on request.
Purchase of Zarlink's I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system conforms to the I2C Standard Specification as defined by Philips. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright Zarlink Semiconductor Inc. All Rights Reserved.
TECHNICAL DOCUMENTATION - NOT FOR RESALE

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